Intel plans to develop processors with more than 1 trillion transistors by 2030. The target was recently announced by the chipmaker’s Components Research and Design Enablement (CRDE) team.
Intel’s researchers presented several processes, materials and technologies that should make it possible to put more than 1 trillion transistors on a chip by 2030.
New technology
The technologies include a new transistor and packaging technique that improves the speed and efficiency of CPUs. The chipmaker is also working on 3D packaging technology to close the gap between traditional ‘single-die’ processors and new chiplet-based designs.
In addition, Intel is exploring super-thin 2D materials to get more transistors on a chip. A 2D-channel material of just 3 atoms thick has been developed to allow near-perfect transistor switching on a so-called double-gate structure at room temperature. This stretches the limits of silicon, Intel said.
Furthermore, the organization claims to have produced an understandable analysis of electrical contact topologies to 2D materials. According to Intel, this yields transistor channels with more performance and scalability.
In addition, Intel is researching ways to improve the power efficiency and memory of HPC computing by vertically placing on-chip memory above transistors.
Furthermore, 300-millimeter GaN-on-silicon wafers are in development for better 5G performance. According to Intel, improved power functionality will be achieved by developing technology that remembers and retains data when the power is off.
Lastly, Intel is furthering new physics concepts with breakthroughs in the delivery of quantum computing qubits.
Extending Moore’s Law
Intel maintains that its in-house research will extend the validity of Moore’s Law, which predicts that the number of transistors on a chip doubles every two years. Many manufacturers declare the law ‘dead’, but according to Intel, Moore’s Law lives on for the foreseeable future.
Tip: Intel aims to prolong the validity of Moore’s Law well beyond 2025