Tag: Chips

Here you will find all the articles with the tag: Chips.

Germany will most likely block Chinese buyout of Elmos chip factory

Germany will most likely block Chinese buyout of Elmos chip factory

The agency responsible appears to be reversing its previous stance on the transaction. The German government will most likely block the sale of Elmos' chip factory to a Chinese competitor, the company said this week. Elmos develops, produces and markets semiconductors, primarily for use in the a... Read more

date5 months ago
Intel reveals $10 billion savings plan, stock rises

Intel reveals $10 billion savings plan, stock rises

Intel shares climbed more than 5 percent in after-hours trading on Thursday after the organization promised to secure up to $10 billion in cost savings and efficiency improvements. That announcement came as the business issued lower-than-expected profits forecasts for the fiscal year after exc... Read more

date5 months ago
Samsung presents ambitious roadmap for advanced chip manufacturing

Samsung presents ambitious roadmap for advanced chip manufacturing

Samsung has announced an ambitious roadmap for advanced chip manufacturing. The organization aims to step up the competition with Taiwan-based TSMC, according to the Wall Street Journal. The newspaper reports that the South Korean tech giant recently announced a roadmap for highly advanced chip ... Read more

date6 months ago
Meta’s vendor-agnostic toolkit helps optimize AI for various CPUs

Meta’s vendor-agnostic toolkit helps optimize AI for various CPUs

Facebook parent Meta announced the launch of a brand-new set of free development tools for artificial intelligence apps, which help developers optimize AI apps for multiple processors. According to the company, the new open-source AI platform is built on PyTorch, an open-source machine learning ... Read more

date6 months ago
Siemens automates tests of chips with advanced packaging

Siemens automates tests of chips with advanced packaging

Siemens Digital Industries Software, a division of Siemens AG, announced the release of 'Tessent Multi-die'. The technology simplifies the design process for testing chips built with advanced packaging. Traditionally, chips have been packaged with a single silicon tile inside. Now, as the indus... Read more

date6 months ago
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